White beam topography of 300 mm Si wafers

Processing and Characterization of 300 mm Argon-Annealed Wafers

High nitrogen doped 300 mm silicon wafers annealed in 100 % argon ambient were investigated whether modified pulling conditions will lead to improved slip behavior and homogeneous radial oxygen precipitation. It turned out that increasing of the cooling rate during crystal pulling is beneficial on these wafer defect parameters. The void morphology was investigated by TEM and oxygen precipitatio...

Soft-pad grinding of 300 mm wire-sawn silicon wafers: finite element analysis with designed experiments

Silicon wafers are the primary semiconductor substrates used to fabricate Integrated Circuits (ICs). Recently, the industry is making a transition from 200 to 300 mm wafers. To attain very flat 300 mm silicon wafers, grinding has been used to flatten the wire-sawn wafers. However, it is challenging for grinding to remove the waviness induced in wire sawing. To enhance the waviness removal abili...

Appendix III: A Tool for Uniform Coating of 300 mm Wafers with Nanoparticles

A3.

Silicon etching using only Oxygen at high temperature: An alternative approach to Si micro-machining on 150 mm Si wafers

Using a combination of low-pressure oxygen and high temperatures, isotropic and anisotropic silicon (Si) etch rates can be controlled up to ten micron per minute. By varying the process conditions, we show that the vertical-to-lateral etch rate ratio can be controlled from 1:1 isotropic etch to 1.8:1 anisotropic. This simple Si etching technique combines the main respective advantages of both w...

Fusion bonding of Si wafers investigated by x ray diffraction